Wafer Fabrication Equipment

TEL Triase+ TiN system, 300 mm, built in 2022 and located in Malta, USA. Configured for TiN processing with three EXII process chambers, a Yaskawa dual-arm handler, and a FOUP factory interface. Used in the diffusion section.Specifications Manufacturer: TEL Model: TEL Triase+ TiN- TEL Triase+ TiN - Vintage: 2022 Wafer Size: 300 mm Serial Number: T19599 Location: Malta, USA Tool ID: MDX24705 Tool Status: Connected Fab Section: Diffusion Software Version: V5 750R1 CIM: SECS/GEM Process: TiN Configuration Trias Mainframe 3 × EXII Chamber FOUP Factory Interface Yaskawa Dual Arm Handler Not Included Chamber Gate Valve MFC7 2 × LM-Arm End Effector Pads (Rear) 2 × Chamber APC Valve LM-Robot (Front-End) 3 × Process Kit 2 × LM-Arm End Effector Pads (Front) Chemgaurd ClF3 Cabinet 3 × Chamber Trap

Make: Tel

Model: TEL Triase+ TiN- TEL Triase+ TiN -

1 unit @ Best Price

TEL TACTRAS with VIGUS Ix BSP Chambers, 300 mm system, built in 2014 and located in Malta, USA. Configured for MHM Trench process with six VIGUS Ix BSP chambers, a YASKAWA loader module, and three FOUP factory interfaces. This reactive ion etcher is equipped with a nitrogen purge storage and controller.Specifications Manufacturer: TEL Model: TEL TACTRAS with VIGUS Ix BSP Chambers Vintage: 2014 Wafer Size: 300 mm Serial Number: FA1200 Location: Malta, USA Tool ID: ETX28511 Description: Reactive Ion Etcher Tool Status: Connected Fab Section: Etch Software Version: Ver. 6.80 CIM: GEM Process: MHM Trench Configuration 6 × VIGUS Ix BSP Chamber YASKAWA Loader Module 3 × FOUP Factory Interface Nitrogen Purge Storage and Controller Not Included TM Robot Controller PM1 TMP Controller PM1 Lifter Pin Driver

Make: Tel

Model: TEL TACTRAS with VIGUS Ix BSP Chambers

1 unit @ Best Price

TEL Loader Module 300 mm system, built in 2014 and located in Malta, USA. Configured for Vigus BEOL process with six chambers. Suitable for etch applications.Specifications Manufacturer: TEL Model: Loader Module Vintage: 2014 Wafer Size: 300 mm Serial Number: FA1192 Location: Malta, USA Tool ID: ETX28505 Software Version: Ver6.80Rev502 Process: Vigus BEOL Fab Section: Etch Configuration 6 × Chambers Not Included 6 × HV Power Supply 6 × ESC

Make: Tel

Model: Loader Module

1 unit @ Best Price

TEL TELINDY PLUS-A-M 300 mm system, built in 2022 and located in Malta, USA. Configured for HIGH-K processes in the Diffusion section with a wafer transfer robot and a FOUP factory interface.Specifications Manufacturer: TEL Model: TELINDY PLUS-A-M Vintage: 2022 Wafer Size: 300 mm Serial Number: S002210101 Location: Malta, USA Tool ID: FVX25906 Software Version: V8.10 Rev.000 [i01300-00000] CIM: SECS, GEM Process: HIGH-K Fab Section: Diffusion Configuration Wafer Transfer Robot FOUP Factory Interface Not Included Baratron Tree P1 Power Connection Assembly SE-183079 Fin Assembly Disilane Detector P3 P4 Foreline Oring IV7 Sensor Board Behind HMI Screen

Make: Tel

Model: TELINDY PLUS-A-M

1 unit @ Best Price

AMAT AMAT_ENDURA2 CuBM METAL TA ALD_CH 300 mm system, built in 2017 and located in Dresden, Germany. Configured for Tantal ALD (CVD) with an Endura 2 chamber and a FOUP factory interface. Suitable for thin film applications.Specifications Manufacturer: AMAT Model: AMAT_ENDURA2 CuBM METAL TA ALD_CH Vintage: 2017 Wafer Size: 300 mm Serial Number: 000001 -416593R02-PJ-ZC Location: Dresden, Germany Tool ID: MDX820CH3 Tool Status: Connected Fab Section: Thin Film Software Version: 2.8274 toolsoftware Process: Tantal ALD (CVD) Configuration Endura 2 Chamber FOUP Factory Interface Not Included HX 2000 Shimadzu Turbo Controller

Make: Applied Materials

Model: AMAT_ENDURA2 CuBM METAL TA ALD_CH

1 unit @ Best Price

SEMIgear, Inc. Geneva STP300 300 mm system, built in 2013 and located in Dresden, Germany. Configured for solder reflow and tin shell bake with one STP300 chamber, a Genmark Gencobot GB7SZ robot handler, and two FOUP factory interfaces.Specifications Manufacturer: SEMIgear, Inc. Model: Geneva STP300 Vintage: 2013 Wafer Size: 300 mm Serial Number: S16100149 Location: Dresden, Germany Tool ID: OVN516 Description: Reflow Oven Tool Status: Warehouse Fab Section: Lab Software Version: OEM/ GF designed CIM: SECS/GEM Process: Solder Reflow + Tin Shell Bake Configuration STP300 Chamber Genmark Gencobot GB7SZ Robot Handler 2 × FOUP Factory Interface Included Auxiliary Equipment BUSCH Vacuum Pump BA0100

Make: SEMIgear, Inc.

Model: Geneva STP300

1 unit @ Best Price

AMAT AMAT_ENDURA2 METAL Cobald CVD_CH 300 mm system, built in 2017 and located in Dresden, Germany. Configured for Cobalt CVD with one chamber. Suitable for thin film applications.Specifications Manufacturer: AMAT Model: AMAT_ENDURA2 METAL Cobald CVD_CH Vintage: 2017 Wafer Size: 300 mm Serial Number: 000001 - 406925R12-PJ-ZC Location: Dresden, Germany Tool ID: MDX820CH5 Tool Status: Connected Fab Section: Thin Film Software Version: 2.8274 toolsoftware Process: Cobald CVD Configuration Chamber Not Included Turbo Controller HX 2000

Make: Applied Materials

Model: AMAT_ENDURA2 METAL Cobald CVD_CH

1 unit @ Best Price

SANKYO SWH80 200 mm system, built in 1998 and located in Singapore. Configured for cleaning wafer applications with a SMIF factory interface.Specifications Manufacturer: Sankyo Model: SWH80 Vintage: 1998 Wafer Size: 200 mm Serial Number: DOO560910 Location: Singapore Tool ID: ORGAT-02 Tool Status: Running Wafers Fab Section: Clean CIM: SECS,GEM Configuration SMIF Factory Interface

Make: SANKYO

Model: SWH80

1 unit @ Best Price

TEL Certas Wing 300 mm system, built in 2011 and located in Malta, USA. Configured for HF NH3 gas etch with one LM robot handler, two LLM arms, and a FOUP factory interface. Suitable for clean fab sections.Specifications Manufacturer: TEL Model: Certas Wing Vintage: 2011 Wafer Size: 300 mm Serial Number: WJ0039 Location: Malta, USA Tool ID: DCL21006 Tool Status: Disconnected Fab Section: Clean CIM: IFA Process: HF NH3 Gas Etch Configuration LM Robot Handler 3 × FOUP Factory Interface 2 × LLM Arm Not Included Pirani Gauge 2 × Capacitance Manometer 2 × PS1 Solenoid Bank 2 × Bolts for LLM Lid Robot PS1 Center Stage Chiller 4 × Fiber Optics 4 × Linear Rail Bearings

Make: Tel

Model: Certas Wing

1 unit @ Best Price

Hitachi Kokusai DJ-1236VN-DF 300 mm system, built in 2020 and located in Malta, USA. Configured for MT-SiOCN process in the diffusion section with a Toshiba main system, a Hitachi handler system, and a FOUP factory interface.Specifications Manufacturer: Hitachi Kokusai Model: DJ-1236VN-DF Vintage: 2020 Wafer Size: 300 mm Serial Number: T2DW8-11068 Location: Malta, USA Tool ID: FVX23915 Tool Status: Connected Fab Section: Diffusion Software Version: 05.12.02 CIM: GEM Process: MT-SiOCN Configuration 16 × FOUP Factory Interface Handler System Main System Not Included KV-1000 Module For Wafer Break PS21 (Pressure Switch)

Make: Hitachi Kokusai Elec

Model: DJ-1236VN-DF

1 unit @ Best Price

Binder OVEN 200 mm system, built in 2016 and located in Woodlands, Singapore. Configured for baking applications with a main oven body. Suitable for use in the etch section of a fab.Specifications Manufacturer: Binder Model: OVEN Vintage: 2016 Wafer Size: 200 mm Serial Number: 950151 Location: Woodlands, Singapore Tool ID: OVEN-AC1 Tool Status: Disconnected Fab Section: Etch Process: Baking Configuration Main Oven Body

Make: Binder

Model: OVEN

1 unit @ Best Price

AMAT RE12F2ECD129 300 mm system, built in 2007 and located in Dresden, Germany. Configured for Cu Plating in an R&D environment with a mainframe Raider, a robot handler, and two FOUP factory interfaces.Specifications Manufacturer: AMAT Model: RE12F2ECD129 Vintage: 2007 Wafer Size: 300 mm Serial Number: T239162 Location: Dresden, Germany Tool ID: MPX250 Tool Status: Warehouse Fab Section: R&D Software Version: 3.0.0.20 CIM: SECS/GEM Process: Cu Plating Configuration 2 × FOUP Factory Interface Mainframe Raider Robot Handler

Make: Applied Materials

Model: RE12F2ECD129

1 unit @ Best Price