
SEMIgear, Inc. Geneva STP300, 300 mm, 2013
SEMIgear, Inc. Geneva STP300 300 mm system, built in 2013 and located in Dresden, Germany. Configured for solder reflow and tin shell bake with one STP300 chamber, a Genmark Gencobot GB7SZ robot handler, and two FOUP factory interfaces.Specifications Manufacturer: SEMIgear, Inc. Model: Geneva STP300 Vintage: 2013 Wafer Size: 300 mm Serial Number: S16100149 Location: Dresden, Germany Tool ID: OVN516 Description: Reflow Oven Tool Status: Warehouse Fab Section: Lab Software Version: OEM/ GF designed CIM: SECS/GEM Process: Solder Reflow + Tin Shell Bake Configuration STP300 Chamber Genmark Gencobot GB7SZ Robot Handler 2 × FOUP Factory Interface Included Auxiliary Equipment BUSCH Vacuum Pump BA0100







