Chemical Vapor Deposition Equipment

TEL INDY PLUS-I-M 300 mm system, built in 2012 and located in Malta, USA. Configured for Irad Nitride processing with a FOUP factory interface. This tool is part of the diffusion section.Specifications Manufacturer: TEL Model: TEL INDY PLUS-I-M Vintage: 2012 Wafer Size: 300 mm Serial Number: S00001265346 Location: Malta, USA Tool ID: FVX2425 Software Version: TEL Waves Process: Irad Nitride Fab Section: Diffusion Configuration Main System FOUP Factory Interface

Make: Tel

Model: TEL INDY PLUS-I-M

1 unit @ Best Price

TEL TELINDY 300 mm system, built in 2016 and located in Malta, USA. Configured for LT APOLY process in the diffusion section with a wafer transfer robot and a FOUP factory interface.Specifications Manufacturer: TEL Model: TELINDY Vintage: 2016 Wafer Size: 300 mm Serial Number: S00001395165 Location: Malta, USA Tool ID: FVX25300 Software Version: V8.17 Rev.000 [i01500-00000] CIM: SECS, GEM Process: LT APOLY Fab Section: Diffusion Configuration FOUP Factory Interface Wafer Transfer Robot

Make: Tel

Model: TELINDY

1 unit @ Best Price

Applied Materials Producer GT 300 mm system, built in 2014 and located in Malta, USA. Configured for ATRP process with three chambers, an EFEM with loadlock and buffer, and a FOUP factory interface. Includes Brooks Mag8 FX and Kawasaki ATM robots.Specifications Manufacturer: Applied Materials Model: Producer GT Vintage: 2014 Wafer Size: 300 mm Serial Number: 428276 Location: Malta, USA Tool ID: CVD2854 Fab Section: Thin Film Software Version: pmB4.3_61 CIM: SECS, GEM Process: ATRP Process Configuration EFEM with Loadlock and Buffer Brooks Mag8 FX Robot 3 × FOUP Factory Interface 2 × Kawasaki ATM Robot Not Included Gold Box Chamber Lid Cover Foreline Heater Jacket MF EV Manifold Dry Pump UPS Unit RF Strap

Make: Applied Materials

Model: Producer GT

1 unit @ Best Price

AME Precision 5000 200 mm system, built in 1995 and located in Burlington, USA. Configured for ILD processes with a mainframe, a robot handler, and an open cassette factory interface.Specifications Manufacturer: AME Model: Precision 5000 Vintage: 1995 Wafer Size: 200 mm Serial Number: 4373 Location: Burlington, USA Tool ID: 67272V Tool Status: Connected Fab Section: Thin Film Software Version: E5.01E Process: ILD Configuration Mainframe Robot Handler Open Cassette Factory Interface

Make: AME

Model: Precision 5000

1 unit @ Best Price

Wonik IPS MAHA MP 300 mm system, built in 2019 and located in Malta, USA. Configured for SiON deposition with three chambers, an Ulvac covot-6 VAC robot handler, and a FOUP factory interface. Suitable for thin film applications.Specifications Manufacturer: Wonik IPS Model: MAHA MP Vintage: 2019 Wafer Size: 300 mm Serial Number: SE14PE311 Location: Malta, USA Tool ID: CVD24603 Tool Status: Connected Fab Section: Thin Film Software Version: GF.2.4.2_100 CIM: SECS Process: SiON Configuration EFEM with Loadlocks and Buffer Ulvac Covot-6 VAC Robot Handler 3 × FOUP Factory Interface Not Included 2 × Eurotherm Temp TM Robot Blade 3 × Chuck Heater

Make: Wonik IPS

Model: MAHA MP

1 unit @ Best Price

TEL Triase+ TiN system, 300 mm, built in 2022 and located in Malta, USA. Configured for TiN processing with three EXII process chambers, a Yaskawa dual-arm handler, and a FOUP factory interface. Used in the diffusion section.Specifications Manufacturer: TEL Model: TEL Triase+ TiN- TEL Triase+ TiN - Vintage: 2022 Wafer Size: 300 mm Serial Number: T19599 Location: Malta, USA Tool ID: MDX24705 Tool Status: Connected Fab Section: Diffusion Software Version: V5 750R1 CIM: SECS/GEM Process: TiN Configuration Trias Mainframe 3 × EXII Chamber FOUP Factory Interface Yaskawa Dual Arm Handler Not Included Chamber Gate Valve MFC7 2 × LM-Arm End Effector Pads (Rear) 2 × Chamber APC Valve LM-Robot (Front-End) 3 × Process Kit 2 × LM-Arm End Effector Pads (Front) Chemgaurd ClF3 Cabinet 3 × Chamber Trap

Make: Tel

Model: TEL Triase+ TiN- TEL Triase+ TiN -

1 unit @ Best Price

TEL TELINDY PLUS-A-M 300 mm system, built in 2022 and located in Malta, USA. Configured for HIGH-K processes in the Diffusion section with a wafer transfer robot and a FOUP factory interface.Specifications Manufacturer: TEL Model: TELINDY PLUS-A-M Vintage: 2022 Wafer Size: 300 mm Serial Number: S002210101 Location: Malta, USA Tool ID: FVX25906 Software Version: V8.10 Rev.000 [i01300-00000] CIM: SECS, GEM Process: HIGH-K Fab Section: Diffusion Configuration Wafer Transfer Robot FOUP Factory Interface Not Included Baratron Tree P1 Power Connection Assembly SE-183079 Fin Assembly Disilane Detector P3 P4 Foreline Oring IV7 Sensor Board Behind HMI Screen

Make: Tel

Model: TELINDY PLUS-A-M

1 unit @ Best Price

AMAT AMAT_ENDURA2 METAL Cobald CVD_CH 300 mm system, built in 2017 and located in Dresden, Germany. Configured for Cobalt CVD with one chamber. Suitable for thin film applications.Specifications Manufacturer: AMAT Model: AMAT_ENDURA2 METAL Cobald CVD_CH Vintage: 2017 Wafer Size: 300 mm Serial Number: 000001 - 406925R12-PJ-ZC Location: Dresden, Germany Tool ID: MDX820CH5 Tool Status: Connected Fab Section: Thin Film Software Version: 2.8274 toolsoftware Process: Cobald CVD Configuration Chamber Not Included Turbo Controller HX 2000

Make: Applied Materials

Model: AMAT_ENDURA2 METAL Cobald CVD_CH

1 unit @ Best Price

Hitachi Kokusai DJ-1236VN-DF 300 mm system, built in 2020 and located in Malta, USA. Configured for MT-SiOCN process in the diffusion section with a Toshiba main system, a Hitachi handler system, and a FOUP factory interface.Specifications Manufacturer: Hitachi Kokusai Model: DJ-1236VN-DF Vintage: 2020 Wafer Size: 300 mm Serial Number: T2DW8-11068 Location: Malta, USA Tool ID: FVX23915 Tool Status: Connected Fab Section: Diffusion Software Version: 05.12.02 CIM: GEM Process: MT-SiOCN Configuration 16 × FOUP Factory Interface Handler System Main System Not Included KV-1000 Module For Wafer Break PS21 (Pressure Switch)

Make: Hitachi Kokusai Elec

Model: DJ-1236VN-DF

1 unit @ Best Price

TEL FORMULA-1S-H 300 mm system, built in 2008 and located in Woodlands, Singapore. Configured as an LPCVD Nitride furnace with a TEL Formula Robot and two FOUP factory interfaces.Specifications Manufacturer: TEL Model: TEL FORMULA-1S-H Vintage: 2008 Wafer Size: 300 mm Serial Number: P00000875063 Location: Woodlands, Singapore Tool ID: DFRN712 Tool Status: Connected Fab Section: Diffusion Software Version: V2.12 Rev.R000 CIM: SECS Process: Nitride Configuration Main System TEL Formula Robot 2 × FOUP Factory Interface

Make: Tel

Model: TEL FORMULA-1S-H

1 unit @ Best Price

ASM XP4 300 mm system, built in 2012 and located in Malta, USA. Configured for atomic layer deposition with two chambers, a vacuum transfer module, and a FOUP factory interface.Specifications Manufacturer: ASM Model: XP4 Vintage: 2012 Wafer Size: 300 mm Serial Number: 1E0886600-01 Location: Malta, USA Tool ID: RTA2480 Software Version: 1.68c4-003 CIM: unknown Process: ALD Fab Section: Diffusion Configuration Front End with Load Ports Vacuum Transfer Module 2 × Chambers FOUP Factory Interface Not Included 2 × Gate Valves 3 × Computers Back End Robot 2 × Chamber Kits

Make: ASM

Model: XP4

1 unit @ Best Price

TEL FORMULA-1S-H 300 mm system, built in 2008 and located in Woodlands, Singapore. Configured for LPCVD nitride processes with a FOUP factory interface and a TEL Formula robot handler. Suitable for diffusion applications.Specifications Manufacturer: TEL Model: TEL FORMULA-1S-H Vintage: 2008 Wafer Size: 300 mm Serial Number: P00000835025 Location: Woodlands, Singapore Tool ID: DFRN710 Tool Status: Connected Fab Section: Diffusion Software Version: V2.12 Rev.R000 CIM: SECS Process: Nitride Configuration 2 × FOUP Factory Interface Main System TEL Formula Robot Handler

Make: Tel

Model: TEL FORMULA-1S-H

1 unit @ Best Price