Manufacturer: Tel

TEL INDY PLUS 300 mm system, built in 2021 and located in Malta, USA. Configured for low temperature copper anneal with a KHI 3 Axis, five fork variable pitch handler and two FOUP factory interfaces.Specifications Manufacturer: TEL Model: TEL INDY PLUS Vintage: 2021 Wafer Size: 300 mm Serial Number: S00002120121 Location: Malta, USA Tool ID: FVX26012 Tool Status: Disconnected Fab Section: Implant Software Version: WAVES 8.1 CIM: SECS/GEM Process: Cu-Anneal Configuration 2 × FOUP Factory Interface KHI 3 Axis, Five Fork Variable Pitch Handler Low Temperature Copper Anneal Furnace

Make: Tel

Model: TEL INDY PLUS

1 unit @ Best Price

TEL INDY PLUS-I-M 300 mm system, built in 2012 and located in Malta, USA. Configured for Irad Nitride processing with a FOUP factory interface. This tool is part of the diffusion section.Specifications Manufacturer: TEL Model: TEL INDY PLUS-I-M Vintage: 2012 Wafer Size: 300 mm Serial Number: S00001265346 Location: Malta, USA Tool ID: FVX2425 Software Version: TEL Waves Process: Irad Nitride Fab Section: Diffusion Configuration Main System FOUP Factory Interface

Make: Tel

Model: TEL INDY PLUS-I-M

1 unit @ Best Price

TEL TELINDY 300 mm system, built in 2016 and located in Malta, USA. Configured for LT APOLY process in the diffusion section with a wafer transfer robot and a FOUP factory interface.Specifications Manufacturer: TEL Model: TELINDY Vintage: 2016 Wafer Size: 300 mm Serial Number: S00001395165 Location: Malta, USA Tool ID: FVX25300 Software Version: V8.17 Rev.000 [i01500-00000] CIM: SECS, GEM Process: LT APOLY Fab Section: Diffusion Configuration FOUP Factory Interface Wafer Transfer Robot

Make: Tel

Model: TELINDY

1 unit @ Best Price

TEL Triase+ TiN system, 300 mm, built in 2022 and located in Malta, USA. Configured for TiN processing with three EXII process chambers, a Yaskawa dual-arm handler, and a FOUP factory interface. Used in the diffusion section.Specifications Manufacturer: TEL Model: TEL Triase+ TiN- TEL Triase+ TiN - Vintage: 2022 Wafer Size: 300 mm Serial Number: T19599 Location: Malta, USA Tool ID: MDX24705 Tool Status: Connected Fab Section: Diffusion Software Version: V5 750R1 CIM: SECS/GEM Process: TiN Configuration Trias Mainframe 3 × EXII Chamber FOUP Factory Interface Yaskawa Dual Arm Handler Not Included Chamber Gate Valve MFC7 2 × LM-Arm End Effector Pads (Rear) 2 × Chamber APC Valve LM-Robot (Front-End) 3 × Process Kit 2 × LM-Arm End Effector Pads (Front) Chemgaurd ClF3 Cabinet 3 × Chamber Trap

Make: Tel

Model: TEL Triase+ TiN- TEL Triase+ TiN -

1 unit @ Best Price

TEL TACTRAS with VIGUS Ix BSP Chambers, 300 mm system, built in 2014 and located in Malta, USA. Configured for MHM Trench process with six VIGUS Ix BSP chambers, a YASKAWA loader module, and three FOUP factory interfaces. This reactive ion etcher is equipped with a nitrogen purge storage and controller.Specifications Manufacturer: TEL Model: TEL TACTRAS with VIGUS Ix BSP Chambers Vintage: 2014 Wafer Size: 300 mm Serial Number: FA1200 Location: Malta, USA Tool ID: ETX28511 Description: Reactive Ion Etcher Tool Status: Connected Fab Section: Etch Software Version: Ver. 6.80 CIM: GEM Process: MHM Trench Configuration 6 × VIGUS Ix BSP Chamber YASKAWA Loader Module 3 × FOUP Factory Interface Nitrogen Purge Storage and Controller Not Included TM Robot Controller PM1 TMP Controller PM1 Lifter Pin Driver

Make: Tel

Model: TEL TACTRAS with VIGUS Ix BSP Chambers

1 unit @ Best Price

TEL Loader Module 300 mm system, built in 2014 and located in Malta, USA. Configured for Vigus BEOL process with six chambers. Suitable for etch applications.Specifications Manufacturer: TEL Model: Loader Module Vintage: 2014 Wafer Size: 300 mm Serial Number: FA1192 Location: Malta, USA Tool ID: ETX28505 Software Version: Ver6.80Rev502 Process: Vigus BEOL Fab Section: Etch Configuration 6 × Chambers Not Included 6 × HV Power Supply 6 × ESC

Make: Tel

Model: Loader Module

1 unit @ Best Price

TEL TELINDY PLUS-A-M 300 mm system, built in 2022 and located in Malta, USA. Configured for HIGH-K processes in the Diffusion section with a wafer transfer robot and a FOUP factory interface.Specifications Manufacturer: TEL Model: TELINDY PLUS-A-M Vintage: 2022 Wafer Size: 300 mm Serial Number: S002210101 Location: Malta, USA Tool ID: FVX25906 Software Version: V8.10 Rev.000 [i01300-00000] CIM: SECS, GEM Process: HIGH-K Fab Section: Diffusion Configuration Wafer Transfer Robot FOUP Factory Interface Not Included Baratron Tree P1 Power Connection Assembly SE-183079 Fin Assembly Disilane Detector P3 P4 Foreline Oring IV7 Sensor Board Behind HMI Screen

Make: Tel

Model: TELINDY PLUS-A-M

1 unit @ Best Price

TEL Certas Wing 300 mm system, built in 2011 and located in Malta, USA. Configured for HF NH3 gas etch with one LM robot handler, two LLM arms, and a FOUP factory interface. Suitable for clean fab sections.Specifications Manufacturer: TEL Model: Certas Wing Vintage: 2011 Wafer Size: 300 mm Serial Number: WJ0039 Location: Malta, USA Tool ID: DCL21006 Tool Status: Disconnected Fab Section: Clean CIM: IFA Process: HF NH3 Gas Etch Configuration LM Robot Handler 3 × FOUP Factory Interface 2 × LLM Arm Not Included Pirani Gauge 2 × Capacitance Manometer 2 × PS1 Solenoid Bank 2 × Bolts for LLM Lid Robot PS1 Center Stage Chiller 4 × Fiber Optics 4 × Linear Rail Bearings

Make: Tel

Model: Certas Wing

1 unit @ Best Price

TEL Lithius 300 mm system, built in 2005 and located in Singapore. Configured for 193NM ARF lithography with a main tool, TCU, TCT, and a FOUP factory interface. The system includes IRAS and IRAM handlers.Specifications Manufacturer: TEL Model: Lithius Vintage: 2005 Wafer Size: 300 mm Serial Number: G250319 Location: Singapore Tool ID: LATK702 Tool Status: Warehouse Fab Section: Lithography Software Version: 3.00.71 CIM: SECS Process: 193NM ARF Configuration TCU Main Tool TCT 4 × FOUP Factory Interface 2 × BCT 2 × COT 5 × DEV Included Auxiliary Equipment IRAS IRAM CRA 2 × PRA

Make: Tel

Model: Lithius

1 unit @ Best Price

TEL FORMULA-1S-H 300 mm system, built in 2008 and located in Woodlands, Singapore. Configured as an LPCVD Nitride furnace with a TEL Formula Robot and two FOUP factory interfaces.Specifications Manufacturer: TEL Model: TEL FORMULA-1S-H Vintage: 2008 Wafer Size: 300 mm Serial Number: P00000875063 Location: Woodlands, Singapore Tool ID: DFRN712 Tool Status: Connected Fab Section: Diffusion Software Version: V2.12 Rev.R000 CIM: SECS Process: Nitride Configuration Main System TEL Formula Robot 2 × FOUP Factory Interface

Make: Tel

Model: TEL FORMULA-1S-H

1 unit @ Best Price

TEL FORMULA-1S-H 300 mm system, built in 2008 and located in Woodlands, Singapore. Configured for LPCVD nitride processes with a FOUP factory interface and a TEL Formula robot handler. Suitable for diffusion applications.Specifications Manufacturer: TEL Model: TEL FORMULA-1S-H Vintage: 2008 Wafer Size: 300 mm Serial Number: P00000835025 Location: Woodlands, Singapore Tool ID: DFRN710 Tool Status: Connected Fab Section: Diffusion Software Version: V2.12 Rev.R000 CIM: SECS Process: Nitride Configuration 2 × FOUP Factory Interface Main System TEL Formula Robot Handler

Make: Tel

Model: TEL FORMULA-1S-H

1 unit @ Best Price

TEL CLEANTRACK ACT8 200 mm system, built in 1999 and located in Burlington, USA. Configured for photolithography apply/develop with two three-axis robots, two four-axis robots, and an open cassette factory interface.Specifications Manufacturer: TEL Model: TEL CLEANTRACK ACT8 Vintage: 1999 Wafer Size: 200 mm Serial Number: 9290693 Location: Burlington, USA Tool ID: 93E69X Tool Status: Connected Fab Section: Lithography Software Version: 204000r130r131 Process: Photolithography Apply/ Develop Configuration Main Tool Body 2 × Three-Axis Robots 2 × Four-Axis Robots 2 × Chemical Cabinets 4 × Open Cassette Factory Interface Included Auxiliary Equipment 3-2 Spin Motor Driver 3-4 Spin Motor Driver Block 2 PRA Power Slice ACT8 Main Controller 3-3 Spin Motor Driver Not Included Pumps Chillers Abatement

Make: Tel

Model: TEL CLEANTRACK ACT8

1 unit @ Best Price