
HSEB ODIN-A30, 300 mm, 2012
HSEB ODIN-A30 300 mm system, built in 2012 and located in Dresden, Germany. Configured for wafer inspection with an automated wafer handling system and two FOUP factory interfaces. Designed for defect detection applications.Specifications Manufacturer: HSEB Model: ODIN-A30 Vintage: 2012 Wafer Size: 300 mm Serial Number: 2100168 Location: Dresden, Germany Tool ID: AMI801 Tool Status: Warehouse Fab Section: Defect Detection Software Version: TC*1.15.5/10.2.00 CIM: SECS/GEM Process: Wafer Inspection Tool Configuration Meas System Automated Wafer Handling 2 × FOUP Factory Interface




