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Your search for Manufacturer: Suss MicroTec
found:
  • 3 Listing(s) with a matching description:
 Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes Location
Make Model
  $  
182307
Suss Microtec  

Suss Microtec  

 

List all items of this typeMicroscope Inspection Items - Other

in Microscopes, Optical Inspection

 1 Inquire F* Fishkill, New York, United States
Suss Microtec BA300-MIT, 300mm Automated Inspection Tool:
Suss Microtec 300mm Automated Inspection Tool, BA300-MIT

Automated inspection tool inspects glass plates 13" x 14" molds do determine filling

Tool ID: MIT01
182280
Suss MicroTec  

Suss MicroTec  

HVMMFT 

List all items of this typeOther Items and Mixed Lots

in Chambers, Components, Accessories and Other Items

 1 Inquire East Fishkill, NY, United States
Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, solder bumps:
Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, 

automated injection molded solder mold filling tool.
deposit solder in mold openings in the front face of molds.
Input and output ports (Mold Load Ports, or MLPs) which will allow mold carts to dock to
the equipment in order to load and unload molds.
182306
Suss MicroTec  

Suss MicroTec  

HVMMFT, Mold Fill Tool, 300mm, C4,  

List all items of this typeOther Items and Mixed Lots

in Chambers, Components, Accessories and Other Items

 1 Inquire Fishkill, NY, United States
Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, :

Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, solder bumps

Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, 

automated injection molded solder mold filling tool.
deposit solder in mold openings in the front face of molds.
Input and output ports (Mold Load Ports, or MLPs) which will allow mold carts to dock to
the equipment in order to load and unload molds.

 

Tool ID: MFT02

 

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.