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FULL DESCRIPTION of Item 182280

in Other Items and Mixed Lots
Item ID: 182280

Offered1 Offered Inquire


Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, solder bumps

Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, 

automated injection molded solder mold filling tool.
deposit solder in mold openings in the front face of molds.
Input and output ports (Mold Load Ports, or MLPs) which will allow mold carts to dock to
the equipment in order to load and unload molds.  

Tool ID: MFT01

Suss Microtec HVMMFT, Mold Fill Tool, 300mm, C4, solder bumps
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Location: East Fishkill, NY, United States
Unit Price Inquire
Number of Units 1
Manufacturer Suss MicroTec
Model HVMMFT
Description Automatic Injection Molded Solder Mold Filling tool

Shipping & Handling:

All freight cost estimates are for dock to dock service only.
Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.
GLOBALFOUNDRIES is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.
 
Payment:

All other sales, including foreign sales, are prepayment only.
MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.